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Dear Ryuichi,
Thanks for preparing this contribution.
Here are my thoughts:
- the goal of the spec text developed in 26/0396 seems to be to allow non-AP MLD to transmit UL to current AP MLD after the ST execution is started, to allow getting this UL out OTA, to perhaps reduce the OTA delay component. I think that the benefits of this
on the overall of UL are unclear, since the additional delay will be re-inserted due to the need of forwarding to that target AP MLD.
- risk: When the client prepares an MPDU for the current AP MLD with MSDUs, it is unclear whether the non-AP MLD would be able to recover such MSDUs and repackage them into a new MPDU for the target AP MLD, for example in the case of the link with the current
AP MLD being unreliable/dying. So there is a tangible risk to lose even more MSDUs if the client keeps insisting to package and transmit more MPDUs for the current AP MLD.
Happy to hear your thought on the above, I am currently unsure that the additional spec/implementation complexity is warranted for adoption.
Best,
Giovanni
From: Ryuichi.Hirata@xxxxxxxx <Ryuichi.Hirata@xxxxxxxx>
Sent: Thursday, June 4, 2026 08:59 To: STDS-802-11-TGBN@xxxxxxxxxxxxxxxxx <STDS-802-11-TGBN@xxxxxxxxxxxxxxxxx> Subject: [STDS-802-11-TGBN] Discussion on 11-26/0396(UL transmission in SMD BSS Transition) WARNING: This email originated from outside of Qualcomm. Please be wary of any links or attachments, and do not enable macros.
Hi all,
I am sending this email to kick off the offline discussion on document 26/396, which I presented during the joint call.
Please feel free to share your comments or questions.
Best regards,
Ryuichi
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