IEEE 802.3 New Ethernet Applications Ad hoc
Ethernet for AI Assessment
24 June 2025 Electronic Meeting
|
Agenda and General
Information |
24-Jun-2025 | John D'Ambrosia | Futurewei, U.S. Subsidiary of Huawei |
|
Unapproved Minutes |
27-Jun-2025 |
John D'Ambrosia |
Futurewei, U.S. Subsidiary of Huawei |
Technical Presentations |
|||
| UALink 200G 1.0 Specification Overview: Data Link Layer (DL) and Physical Layer (PL) | 23-Jun-2025 |
Kent Lusted Dave Brown |
Synopsys AMD |
| PAMXmY Modulation Proposal for 448G | 24-Jun-2025 | Peter Graumann | Microchip |
| Physical Considerations for Intrapair Skew Characterization and Measurement | 23-Jun-2025 |
Rohan Phadke Jason Chan Jim Weaver |
Arista Networks |
| 400 Gb/s+ Per Lane Transmission with PAM4, 6, 8 | 24-Jun-2025 |
Yu Xu Fangyi Tang Ping Liao |
Huawei Technologies |
Last Update: 27-Jun-2025
Back to E4AI Asessment Public Page
|
|
|
|
|
![[Search]](http://grouper.ieee.org/img/search.gif)
![[e-mail]](http://grouper.ieee.org/img/email.gif){kind=small}
![[Standards Home Page]](http://grouper.ieee.org/img/home.gif)
![[Corporate Home Page]](http://grouper.ieee.org/img/corp.gif)